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Integrated Service Technology Inc. research, develops, and manufactures integrated circuits, analysis and burn-in, and testing in Taiwan and internationally. The company provides MOSFET wafer backend processes, which offer MOSFET front-side metallization, such as chemical/electro-less plating and front-side metal sputtering deposition; MOSFET backside grinding processes; MOSFET backside metallization processes comprising metal evaporation deposition and thick Ag process; and turnkey solutions for backend processes, which include chip probing, laser marking, vacuum mounting, ring removal, die…
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